FlexAL ALD System

FlexAL ALD System - Nano Vacuum

FlexAL ALD System

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The FlexAL systems provide a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD) processes and thermal ALD within a single ALD system.

  • Remote plasma & thermal ALD in one flexible tool
  • Clusterable for vacuum transfer of substrates
  • Cassette to cassette handling increases throughput suitable for production
  • Maximum flexibility in the choice of materials & precursors
  • Low-temperature processes enabled by plasma ALD
  • Low damage maintained by the use of remote plasma
  • Controllable, repeatable processes via recipe-driven software interface
  • Ability to handle up to 200mm wafer

System Features:

Oxford Instruments has an extensive process library, and new processes are continually being developed. We provide free on-going process support for the lifetime of any ALD tool, offering advice on developing new materials and continued access to our latest ALD process developments including new process recipes.

Integral glove box on precursor modules - In-situ change-over

Integral ports - Allow the addition of in-situ ellipsometry measurement tools

Clusterable - Vacuum transfer of substrates

Cassette to cassette handling - Increases throughput suitable for production

Robotic handler and cassette - Handles 100mm, 150mm or 200mm wafers (no tools required to swap between wafers).

All configurations can be located entirely within the cleanroom or through-the-wall - Easy to site

Automated 200mm load lock - Process flexibility


  • Nano-electronics
  • High-k gate oxides
  • Storage capacitor dielectrics
  • High aspect ratio diffusion barriers for Cu interconnects
  • Pinhole-free passivation layers for OLEDs and polymers
  • Passivation of crystal silicon solar cells
  • Highly conformal coatings for microfluidic and MEMS applications
  • Coating of nanoporous structures
  • Bio MEMS
  • Fuel cells

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