Wire & Die Bonders

TPT Wire Bonder is an owner-managed company that develops and manufactures semi-automatic wire bonder with over 30 years of experience in wire bonding technology.
Our bonders stand out with intuitive operation, innovation an optimal performance.
We’ve been successfully selling bonders to more than 40 countries worldwide and have partners in many countries that provide technical support and service.
Our customers include the world's leading companies and universities.

Wire & Die Bonders

The HB05 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond...
The HB10 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond...
The HB16 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond...
The HB100 is a new generation of automatic desktop wire bonders. It is suited for laboratories and small...
The HB30 is a bench top size wire bonder, ideal for laboratories and pilot production lines. Ideal for...
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