{"title":"ICPCVD Systems","description":"\u003ch3 class=\" \"\u003eInductively Coupled Plasma Chemical Vapour Deposition (ICPCVD)\u003c\/h3\u003e\r\n\u003cp\u003eCreation of high density plasmas in the ICP source means this technique delivers deposition of high quality dielectric films at low temperature with low damage. Low temperature deposition means that temperature sensitive films and devices can be processed successfully.\u003c\/p\u003e\r\n\u003cp\u003e\u003cimg src=\"\/\/cdn.shopify.com\/s\/files\/1\/0117\/2714\/2969\/files\/ICPCVD_Explaination_large.png?v=1529458113\" alt=\"Oxford Instruments ICPCVD\"\u003e\u003c\/p\u003e\r\n\u003ch4 class=\"color-beta \"\u003eHighlights\u003c\/h4\u003e\r\n\u003cul\u003e\r\n\u003cli\u003eIndependent control of ion energy and ion current density\u003c\/li\u003e\r\n\u003cli\u003eTypical process pressure: 1- 10 mtorr\u003c\/li\u003e\r\n\u003cli\u003ePlasma density: circa 5 x E11 \/ cm\u003csup\u003e2\u003c\/sup\u003e\n\u003c\/li\u003e\r\n\u003cli\u003ePlasma in contact with the substrate\u003c\/li\u003e\r\n\u003cli\u003eLow energy ion current during deposition\u003c\/li\u003e\r\n\u003cli\u003eIon Current (Plasma Density) dependent on ICP power\u003c\/li\u003e\r\n\u003cli\u003eESS (electrostatic screen) for a purely inductive plasma\u003c\/li\u003e\r\n\u003cli\u003eICP is fully automatic (2 RF automatch units)\u003c\/li\u003e\r\n\u003c\/ul\u003e\r\n\u003ch4\u003eFeatures \u0026amp; Benefits\u003c\/h4\u003e\r\n\u003cul\u003e\r\n\u003cli\u003eExcellent quality low damage films at reduced temperatures.\u003c\/li\u003e\r\n\u003cli\u003eTypical materials deposited include SiO\u003csub\u003e2\u003c\/sub\u003e, Si\u003csub\u003e3\u003c\/sub\u003eN\u003csub\u003e4\u003c\/sub\u003e\u003cspan\u003e \u003c\/span\u003eand SiON, Si and SiC at substrate temperatures as low as 5ºC\u003c\/li\u003e\r\n\u003cli\u003eICP source sizes of 65mm, 180mm, 300mm delivering process uniformity up to 200mm wafers\u003c\/li\u003e\r\n\u003cli\u003eElectrodes available for temperature ranges from 5ºC to 400ºC\u003c\/li\u003e\r\n\u003cli\u003ePatented ICPCVD gas distribution technology\u003c\/li\u003e\r\n\u003cli\u003eIn situ chamber cleaning with endpointing\u003c\/li\u003e\r\n\u003c\/ul\u003e\r\n\u003ch4\u003eICPCVD Chamber Clean\u003c\/h4\u003e\r\n\u003cp\u003e\u003cstrong\u003eOur ICPCVD cleaning regime was developed to give reproducible deposition and low particles between mechanical cleans\u003c\/strong\u003e\u003c\/p\u003e\r\n\u003cul\u003e\r\n\u003cli\u003eReduced cleaning time\u003c\/li\u003e\r\n\u003cli\u003eHigher utilisation through optional interleaved clean\u003c\/li\u003e\r\n\u003cli\u003eAccurate endpoint resulting in reduced over-etch of chamber components and increasing their lifetime\u003c\/li\u003e\r\n\u003c\/ul\u003e\r\n\u003cp\u003e\u003cimg src=\"\/\/cdn.shopify.com\/s\/files\/1\/0117\/2714\/2969\/files\/ICPCVD_Endpoint_Picture_large.png?v=1529458026\" alt=\"Oxford Instruments ICPCVD Plasma Clean Comparison\"\u003e\u003c\/p\u003e\r\n\u003ch4 class=\"color-beta\"\u003eHigh Rate Clean Process Features\u003c\/h4\u003e\r\n\u003cul\u003e\r\n\u003cli\u003eSystem Utilisation \u0026gt;70%\u003c\/li\u003e\r\n\u003cli\u003eSF\u003csub\u003e6\u003c\/sub\u003e\u003cspan\u003e \u003c\/span\u003e\/N\u003csub\u003e2\u003c\/sub\u003eO gas mixture\u003c\/li\u003e\r\n\u003cli\u003eImproved End Point control\u003c\/li\u003e\r\n\u003cli\u003ePlasma clean results in increased optical intensity with greater endpoint signal\/resolution\u003c\/li\u003e\r\n\u003cli\u003eActual plasma clean time depends on film material, film quality and film thickness\u003c\/li\u003e\r\n\u003c\/ul\u003e\r\n\u003ch4 class=\"color-beta\"\u003eInterleaved Clean Mode \u003c\/h4\u003e\r\n\u003cul\u003e\r\n\u003cli\u003eHigh utilisation\u003c\/li\u003e\r\n\u003cli\u003eHighly repeatable deposition rate\u003c\/li\u003e\r\n\u003cli\u003eLow added particle counts maintained with clean after every wafer\u003c\/li\u003e\r\n\u003cli\u003e\u0026gt; 50 microns between mechanical cleans\u003c\/li\u003e\r\n\u003c\/ul\u003e","products":[{"product_id":"plasmapro-80-icpcvd","title":"PlasmaPro 80 ICPCVD","description":"\u003cp\u003eThe PlasmaPro 80 is a compact, small footprint system offering versatile etch and deposition solutions with convenient open loading. It is easy to site and easy to use, with no compromise on process quality. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production. It enables high performance processes using optimised electrode cooling and excellent substrate temperature control\u003cstrong\u003e.\u003cbr\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eOpen load design allows fast wafer loading and unloading\u003c\/li\u003e\n\u003cli\u003eExcellent etch control and rate determination\u003c\/li\u003e\n\u003cli\u003eExcellent wafer temperature uniformity\u003c\/li\u003e\n\u003cli\u003eUp to 200mm wafers\u003c\/li\u003e\n\u003cli\u003eLow cost of ownership\u003c\/li\u003e\n\u003cli\u003eBuilt to Semi S2\/S8 standards\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch4\u003eFeatures \u0026amp; Benefits\u003c\/h4\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSmall footprint\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e- Easy to site\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptimised electrode cooling\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e- Substrate temperature control\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh-conductance radial (axially symmetric) pumping configuration\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e- Guaranteed enhanced process uniformity and rates are\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAddition of \u0026lt; 500ms data logging\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e- Traceability and history of chamber and process conditions\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eClose-coupled turbo pump\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e- High pumping speed and excellent base pressure\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eClear ease of access to key components\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e- Improved serviceability and maintenance\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eX20 control system\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e- Greatly increases data retrieval and delivers faster, more repeatable matching\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFault and tool diagnostics via front end software\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e- Rapid fault diagnosis\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLaser end-point detection using interferometry\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e- Measure etch depth in transparent materials on reflective surfaces (for example, oxides on Si), or reflectometry for non-transparent materials (such as metals) to determine layer boundaries\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical emission spectrometry (OES) for large sample or batch process end-pointing\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e- Detecting changes in etch by-products or depletion of reactive gas species, and for chamber clean end-pointing\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch4\u003eApplications\u003c\/h4\u003e\n\u003cul\u003e\n\u003cli\u003eIII-V etch processes\u003c\/li\u003e\n\u003cli\u003eSilicon Bosch and cryo-etch processes\u003c\/li\u003e\n\u003cli\u003eDiamond Like Carbon\u003c\/li\u003e\n\u003cli\u003e(DLC) deposition\u003c\/li\u003e\n\u003cli\u003eSiO\u003csub\u003e2\u003c\/sub\u003e\u003cspan\u003e \u003c\/span\u003eand quartz etch\u003c\/li\u003e\n\u003cli\u003eFailure analysis dry etch de-processing using the specially-configured PlasmaPro FA tools ranging from packaged chip and die etch through to full 200mm wafer etch\u003c\/li\u003e\n\u003cli\u003eHigh quality PECVD of silicon nitride and silicon dioxide for photonics, dielectric layers, passivation and many other uses\u003c\/li\u003e\n\u003cli\u003eHard mask deposition and etch for high brightness LED production\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0117\/2714\/2969\/files\/OIPT-PlasmaPro_80-Brochure.pdf?v=1604015635\" title=\"\tOIPT-PlasmaPro_80-Brochure.pdf\"\u003e\u003cstrong\u003eDownload Brochure Here:\u003c\/strong\u003e\u003c\/a\u003e\u003c\/p\u003e","brand":"Oxford Instruments Plasma","offers":[{"title":"Default Title","offer_id":10649831899193,"sku":"PlasmaPro80ICPCVD","price":0.0,"currency_code":"AUD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0117\/2714\/2969\/products\/Shopify_Product_Image_4_2f1dcbd3-ab10-4bcb-97ce-9cc8edee75fe.png?v=1539227712"},{"product_id":"plasmapro-100-icpcvd","title":"PlasmaPro 100 ICPCVD","description":"\u003cp\u003eThe ICP CVD process module is designed to produce high quality films from room temperature to 400°C with high density plasmas at low deposition pressures and temperatures.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003eExcellent uniformity, high throughput and high precision processes\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003eHigh quality films\u003c\/li\u003e\n\u003cli\u003eWide temperature range electrode\u003c\/li\u003e\n\u003cli\u003eCompatible with all wafer sizes up to 200mm\u003c\/li\u003e\n\u003cli\u003eRapid change between wafer sizes\u003c\/li\u003e\n\u003cli\u003eLow cost of ownership and ease of serviceability\u003c\/li\u003e\n\u003cli\u003eCompact footprint, flexible layout\u003c\/li\u003e\n\u003cli\u003eResistive heated electrodes with capability up to 400°C or 1200°C\u003c\/li\u003e\n\u003cli\u003eIn-situ chamber cleaning and end-pointing\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cul\u003e\u003c\/ul\u003e\n\u003ch4\u003eFeatures \u0026amp; Benefits\u003c\/h4\u003e\n\u003cul\u003e\n\u003cli\u003eExcellent quality low damage films at reduced temperatures.\u003c\/li\u003e\n\u003cli\u003eTypical materials deposited include\u003cspan\u003e \u003c\/span\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/campaigns\/process\/sio2\"\u003eSiO\u003csub\u003e2\u003c\/sub\u003e\u003c\/a\u003e,\u003cspan\u003e \u003c\/span\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/campaigns\/process\/sinx\"\u003eSi\u003csub\u003e3\u003c\/sub\u003eN\u003csub\u003e4\u003c\/sub\u003e\u003c\/a\u003e\u003cspan\u003e \u003c\/span\u003eand SiON,\u003cspan\u003e \u003c\/span\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/campaigns\/process\/si\"\u003eSi\u003c\/a\u003e\u003cspan\u003e \u003c\/span\u003eand\u003cspan\u003e \u003c\/span\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/campaigns\/process\/sic\"\u003eSiC\u003c\/a\u003e\u003cspan\u003e \u003c\/span\u003eat substrate temperatures as low as 5ºC\u003c\/li\u003e\n\u003cli\u003eICP source sizes of 65mm, 180mm, 300mm delivering process uniformity\u003cbr\u003eup to 200mm wafers\u003c\/li\u003e\n\u003cli\u003eElectrodes available for temperature ranges from 5ºC to 400ºC\u003c\/li\u003e\n\u003cli\u003ePatented ICPCVD gas distribution technology\u003c\/li\u003e\n\u003cli\u003eIn situ chamber cleaning with endpointing\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch4\u003eUpgrades\/Accessories\u003c\/h4\u003e\n\u003cp style=\"display: inline !important;\"\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/dry-pump-n2-standby-mode\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eDry pump N2 standby mode\u003c\/a\u003e - Saves energy and nitrogen\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/gas-pod-upgrade\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eGas pod\u003c\/a\u003e - incorporate extra gas lines and allow greater flexibility\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/logviewer-software\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eLogviewer software\u003c\/a\u003e - datalogging software allows realtime graphing and post run analysis\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/optical-end-point-detectors\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eOptical end point detectors\u003c\/a\u003e - an important tool for achieving optimal process results\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/soft-pump\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eSoft pump\u003c\/a\u003e - allows the slow pumping down of a vacuum chamber\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/turbomolecular-vacuum-pump\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eTurbomolecular vacuum pump\u003c\/a\u003e - offers superior pumping speeds and higher throughput\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/x20-control-system\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eX20 Control System\u003c\/a\u003e - delivers a future proof, flexible and reliable tool with increased system ‘intellect’\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/advanced-energy-paramount-generator\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eAdvanced Energy Paramount generator\u003c\/a\u003e - Offering increased reliability and greater plasma stability\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/automatic-pressure-control\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eAutomatic pressure control\u003c\/a\u003e - This controller ensures very fast and accurate pressure control\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/dual-cm-gauge-switcing\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eDual CM gauge switching\u003c\/a\u003e - provides the ability to utilise two differing ranges of capacitance manometer via a single pressure control valve\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/ln2-autochangeover-unit\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eLN2 autochangeover unit\u003c\/a\u003e - enables table cooling fluid to be automatically switched between Liquid Nitrogen (LN2) and Chiller Fluid\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/teos-liquid-level-sensing\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eTEOS liquid level sensing\u003c\/a\u003e - level sensing is achieved using ultra sonic level sensors fitted to the TEOS canister\u003c\/p\u003e\n\u003cp\u003e\u003ca href=\"https:\/\/plasma.oxinst.com\/support\/upgrades\/wide-temperature-range-electrode\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eWide temperature range electrode\u003c\/a\u003e - significant design improvements to increase process performance\u003c\/p\u003e\n\u003cul\u003e\u003c\/ul\u003e","brand":"Oxford Instruments Plasma","offers":[{"title":"Default Title","offer_id":10649871974457,"sku":"PlasmaPro100ICPCVD","price":0.0,"currency_code":"AUD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0117\/2714\/2969\/products\/Shopify_Product_Image_5_bfa59672-869a-40ca-b207-42e17cb3d969.png?v=1539227715"}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0117\/2714\/2969\/collections\/Shopify_Product_Image_5.png?v=1529458209","url":"https:\/\/nanovactech.com\/collections\/icpcvd-systems\/icpcvd.oembed","provider":"Nano Vacuum Pty Ltd","version":"1.0","type":"link"}