
2" and 4" Spindle Dicing Systems
The 7120/7130 families of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility. With multiple models to choose from, the 7120/7130 Series covers the widest range of applications, offering the lowest Cost-of-Ownership while providing the most advanced dicing technology available:
- Ceramic Substrates & Capacitors
- Automotive Sensors
- Glass on Silicon
- Package Singulation (BGA, QFN)
- SAW Filters
- LTCC
- Glass
- PZT
- LED & LED on PCB Packages
- Opto-electronic Components
- Sensors & MEMS
- IC Wafers
ADVANTAGE
- 2” and 4” spindle dicing systems
- A full range of automatic vision capabilities
- Advanced hardware platform for high reliability and low maintenance
- Heavy Duty, cast-iron base structure for superior precision and accuracy
- Increased yield, throughput and process control
- Unique multi-panel processing capabilities
- Special blade wear forecast algorithm
- User-friendly software platform
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