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Spindle Dicing Systems

2" and 4" Spindle Dicing Systems 

The 7120/7130 families of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility. With multiple models to choose from, the 7120/7130 Series covers the widest range of applications, offering the lowest Cost-of-Ownership while providing the most advanced dicing technology available:

  • Ceramic Substrates & Capacitors
  • Automotive Sensors 
  • Glass on Silicon
  • Package Singulation (BGA, QFN)
  • SAW Filters
  • LTCC
  • Glass
  • PZT
  • LED & LED on PCB Packages
  • Opto-electronic Components
  • Sensors & MEMS
  • IC Wafers

 

ADVANTAGE

  • 2” and 4” spindle dicing systems
  • A full range of automatic vision capabilities
  • Advanced hardware platform for high reliability and low maintenance
  • Heavy Duty, cast-iron base structure for superior precision and accuracy
  • Increased yield, throughput and process control
  • Unique multi-panel processing capabilities
  • Special blade wear forecast algorithm
  • User-friendly software platform
  • May 18, 2020
  • Category: News
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