Spindle Dicing Systems

2" and 4" Spindle Dicing Systems 

The 7120/7130 families of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility. With multiple models to choose from, the 7120/7130 Series covers the widest range of applications, offering the lowest Cost-of-Ownership while providing the most advanced dicing technology available:

• Ceramic Substrates & Capacitors
• Automotive Sensors 
• Glass on Silicon
• Package Singulation (BGA, QFN)
• SAW Filters
• LTCC
• Glass
• PZT
• LED & LED on PCB Packages
• Opto-electronic Components
• Sensors & MEMS
• IC Wafers

ADVANTAGE

• 2” and 4” spindle dicing systems
• A full range of automatic vision capabilities
• Advanced hardware platform for high reliability and low maintenance
• Heavy Duty, cast-iron base structure for superior precision and accuracy
• Increased yield, throughput and process control
• Unique multi-panel processing capabilities
• Special blade wear forecast algorithm
• User-friendly software platform